膜科学与技术

PVDF/PI阳离子交换膜的制备及脱盐性能

作者：王乾杰，李红海，苏保卫

单位： 1.青岛科技大学化工学院，山东青岛 266042；2.中国海洋大学化学化工学院，青岛 266100

关键词：阳离子交换膜；表面修饰；电渗析；浸没沉淀相转化；交联

出版年,卷(期):页码： 2021,41(1):1-9

摘要：

通过浸没沉淀相转化的方法制备了聚偏氟乙烯（PVDF）/聚酰亚胺（PI）共混膜，然后使用4,4’-二氨基二苯乙烯-2,2’-二磺酸与三乙胺（DASD-TEA）溶液修饰共混膜表面，制备出PVDF/PI阳离子交换膜。探究了DASD-TEA溶液的浸泡时间、浸泡温度、浓度与PI的浓度对PVDF/PI阳离子交换膜脱盐率的影响，得出最优的铸膜液配比为19.0 wt%的 PVDF、1.0 wt%的PI和80.0 wt% 的N,N-二甲基甲酰胺（DMF）；最佳的 DASD-TEA溶液修饰条件：0.03 wt% 的DASD，浸泡时间为10.0 min，浸泡温度为50.0 ℃。最佳条件下，PVDF/PI阳离子交换膜的离子交换容量（IEC）为0.32 mmol·g-1，含水率为38.6 %，纯水渗透率为50 L·m-2·h-1·bar-1，接触角为81.9 °，膜面电阻为2.96 Ω·cm2。采用三组膜对的电渗析装置在电压4V和流量40 L/h下对2000 mg/L NaCl溶液进行了120 min的脱盐试验，PVDF/PI阳离子交换膜的脱盐率为商品化阳离子交换膜的1.33倍，其脱盐性能高于商品化阳离子交换膜。

Polyvinylidene fluoride (PVDF)/Polyimide (PI) blend membrane was prepared by the immersion precipitation phase transformation method. Then the PVDF/PI membrane was modified using 4,4'-diaminostilbene-2,2'-disulfonic acid and triethylamine (DASD-TEA) aqueous solution to prepare PVDF/PI cation exchange membrane. The effects of soaking time, temperature, concentration of DASD-TEA solution and PI concentration on the desalination rate of the PVDF/PI cation exchange membrane were explored. The optimal composition of the casting solution is 19.0 wt% PVDF, 1.0 wt% PI and 80.0 wt% N, N-dimethylformamide (DMF). The optimal conditions of the DASD-TEA modification are 0.03 wt% DASD in the DASD-TEA aqueous solution, and soaking at 50.0 ℃ for 10 min. The ion exchange capacity (IEC) of the PVDF/PI cation exchange membrane is 0.32 mmol·g-1, the water content is 38.6%, the pure water permeability is 50 L·m-2·h-1·bar-1, the contact angle is 81.9 °, and the transmembrane resistance is 2.96 Ω·cm2. The desalination experiment was carried out in the electrodialysis device with three membrane pairs under 4 V voltage for 120 min, with 2000 mg/L NaCl solution as feed at a flow rate of 40 L·h-1. The desalination rate of the PVDF/PI cation exchange membrane is 1.33 times that of the commercial cation exchange membrane.。

王乾杰（1994-），男，山东聊城人，硕士研究生，研究方向：传质与分离工程，E-mail: wqjqust@163.com。

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